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DroneCAN / I2C Distribution Board – ArduPilot / PX4 / Pixhawk Compatible
DroneCAN / I2C Distribution Board – ArduPilot / PX4 / Pixhawk Compatible
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The CAN/I2C distribution board is a compact and practical solution for expanding and organizing bus connections in embedded systems such as drones, robotics platforms, and autopilot systems. Designed with flexibility in mind, it features six 4-pin JST GH ports for quick plug-and-play device connections, as well as additional breakout options for custom setups.
Key Features
Connector Configuration:
- 6 × 4-pin JST GH connectors (1.25 mm pitch)
- Supports both CAN and I2C signal distribution depending on system use
- Parallel routing for clean bus splitting
Solderable Breakout Options:
- Solder pads available on both sides of the PCB for direct wire connections
- One edge supports optional 2.54 mm (0.1") header pin installation for breakout to breadboards or dev boards
Mounting:
- 2 × M3 mounting holes (one on each end) for secure attachment to frame or baseplate
- Suitable for integration in UAVs, mobile robots, and compact control boxes
System Compatibility:
- Fully compatible with Pixhawk, Cube, and other ArduPilot / PX4 systems
- Ideal for connecting GPS, airspeed sensors, magnetometers, or any JST-GH-based peripheral
- Compatible cabling available separately
Applications
- Distribute CAN or I2C signals across multiple embedded peripherals
- Build modular harnesses for field-replaceable drone components
- Simplify internal wiring in robotics and flight control systems
- Enable prototyping or debugging with 2.54 mm header breakout
Technical Specifications
Parameter | Value |
---|---|
Ports | 6 × JST GH 4-pin (parallel routing) |
Signal Support | CAN or I2C (bus-agnostic design) |
Additional IO | Dual-side solder pads; 1 × 2.54 mm header footprint |
Mounting | 2 × M3 holes (symmetric placement) |
Supply Voltage | 3.3 V or 5 V signal logic compatible |
Board Dimensions | 59 mm x 12 mm |
This board is ideal for maintaining clean, expandable wiring in space-constrained systems where reliability and modularity are critical.
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